Bare-die VPA MMICs form the device-level catalog, with packaged PA IC options used when handling, assembly, or evaluation constraints call for a sealed part.
Explore MMICsPowering RF Intelligence.
Enabling high-performance microwave systems with GaN power devices and RF front-end modules.
Capability Snapshot
Three capability lanes. One coherent RF stack.
Velion organizes its offer by integration level: GaN PA MMICs and packaged PA ICs at device level, RF FEM for front-end evaluation, and RF modules for system-specific integration.
From Spec to Schedule
From first spec to production.
Submit the spec, let our engineers review it, then move through outreach, meeting setup, sample shipment, product matching or development, and production.
STEP 01
Submit your spec
Share the RF spec, target band, power goal, or system brief.
STEP 02
Engineer review
Our engineers review fit, constraints, and the most credible starting path.
STEP 03
Reach out and schedule
We reach out directly and schedule an online or face-to-face meeting with you.
STEP 04
Send sample
If evaluation is the right next step, we prepare and send the sample.
STEP 05
Match product or develop
We match an existing product or move into a custom development path.
STEP 06
Production
After validation and alignment, the program moves into production.
Product Spectrum
Where does your RF program start?
Use this quick view to identify the product path that best matches your band, integration level, and project stage before you dive deeper.
Frequency band
Integration level
GaN MMIC
Packaged IC
RF FEM
RF Module
D110-220
V-W40-110
K-KA18-40
KU12-18
X8-12
C4-8
L-S0.4-4
GaN PA MMICs
Packaged PA ICs
RF FEM
RF Modules
Proven Industries
Velion is proven in the following industries.
Three industry views show how Velion's RF stack supports practical deployment needs across demanding RF programs.
Phased-array radar
Validated where density, thermal control, and array-level integration all matter at the same time.
Vertical Insights
Why teams choose Velion across the RF stack?
Device decisions shape module behavior. Module decisions shape program outcomes. Velion works across these layers so teams can move from MMICs and packaged ICs to RF FEM and RF modules without losing the system context.
Engineering Note / Apr 2026
When Antenna Switch Isolation Sets the RF Front-End Module Boundary
A practical engineering note on when antenna switch isolation becomes a front-end module decision, not just a routing spec, and what RF teams should capture before choosing the module boundary.
Read articleEngineering Note / Apr 2026
What BAW Changes in RF Front-End Modules, and What It Does Not
A practical engineering note on what BAW materially changes inside an RF front-end module, and where SAW or advanced SAW still keep the sharper cost-performance boundary.
Read articleEngineering Note / Apr 2026
When MIPI RFFE Pays Off in RF Front-End Modules
A practical engineering note on the point where direct pin control stops scaling cleanly and MIPI RFFE starts paying back its extra integration effort in RF front-end modules.
Read articleTurn your RF idea into reality.
From early concepts and free-sample requests to custom RF development, Velion helps promising ideas become practical devices, modules, and next-step engineering plans.
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